What's the difference between bonding and soldering?

Bonding


Definition:

  • (p. pr. & vb. n.) of Bond

Example Sentences:

  • (1) The femoral component, made of Tivanium with titanium mesh attached to it by a new process called diffusion bonding, retains superalloy fatigue strength characteristics.
  • (2) An unsaturated fatty acid auxotroph of Escherichia coli was grown with a series of cis-octadecenoate isomers in which the location of the double bond varied from positions 3 to 17.
  • (3) At pH 7.0, reduction is complete after 6 to 10 h. These results together with an earlier study concerning the positions of the two most readily reduced bonds (Cornell J.S., and Pierce, J.G.
  • (4) It was found that there is a significant difference in bond strengths between enamel and stainless steel with strength to enamel the greater.
  • (5) Since the start of this week, markets have been more cautious, with bond yields in Spain reaching their highest levels in four months on Tuesday amid concern about the scale of the austerity measures being imposed by the government and fears that the country might need a bailout.
  • (6) Genotoxic carcinogens form covalent bonds with proteins as well as with DNA.
  • (7) Accordingly, when bFGF, complexed to heparin, is treated with pepsin A, an aspartic protease with a broad specificity, only the Leu9-Pro10 peptide bond is cleaved generating the 146-amino acid form.
  • (8) The bond distances of Cu to Cl(1), Cl(2), N(3) and N(3') atoms are 2.299 (1), 2.267 (1), 1.985 (4) and 1.996 (3) A, respectively.
  • (9) An unexpected result of the Greek crisis has been a flight of capital into British government bonds, which has seen gilt prices fall.
  • (10) We propose that, for a GC base pair in B conformation, there are two amino proton exchangeable states--a cytosine amino proton exchangeable state and a guanine amino proton exchangeable state; both require the disruption of only the corresponding interbase H bond.
  • (11) Furthermore, we demonstrate that reduction of the disulfide bonds of a pre-processed A-loop containing heterodimeric insulin peptide is required to further process insulin into a T cell epitope.
  • (12) Analysis of bond values of glass ionomer added to glass ionomer indicate bond variability and low cohesive bond strength of the material.
  • (13) All N and O atoms except N(3) and O(4') participate in a three-dimensional hydrogen-bonding system.
  • (14) The coatings formed contain only stable chemical bonds (e.g., C-C, C-O-C), and easily-derivatized hydroxyl moieties.
  • (15) S100b protein, chemically modified by thioethanol groups (linked via disulfide bonds to two out of four Cys per dimer) was largely similar to reduced native S100b protein in its overall structure and differed only by small modifications extending, however, to the whole protein structure.
  • (16) The relative cleavage frequency at the first glycosidic bond counting from the nonreducing end of the substrate increases with increasing substrate concentration.
  • (17) We found that the closer location of Mg2+ to the beta-phosphoryl group than to the alpha- or gamma-phosphoryl group was effective in weakening the P-O bond at which the cleavage of ATP catalyzed by most enzymes takes place.
  • (18) Brief digestion at neutral pH without reduction produced a molecule in which the Fab and Fc fragments were still linked by a pair of labile disulphide bridges, and the Fc fragment released by cleaving these bonds, called 1Fc fragment, contained a portion of the ;hinge' region including an interchain disulphide bridge.
  • (19) Both adiphenine.HCl and proadifen.HCl form more stable complexes, suggesting that hydrogen bonding to the carbonyl oxygen by the hydroxyl-group on the rim of the CD ring could be an important contributor to the complexation.
  • (20) However, peptide bonds between 193 and 194, and 194 and 195 were cleaved in the presence of mAb 1C3 as easily as in the presence of mAb 31A4, suggesting that the region of residues 200 to 202 was obscured by, or within the antibody binding site, but that the region of residues 193 to 195 was not.

Soldering


Definition:

  • (p. pr. & vb. n.) of Solder
  • () a. & n. from Solder, v. t.

Example Sentences:

  • (1) This study compared soldering by a conventional torch procedure with an infrared soldering technique.
  • (2) However, the effect of the soldering atmosphere on the tensile strength was small.
  • (3) No effects on behavioral function were observed among the solderers.
  • (4) This contaminant was not present after a control exposure while soldering on iron.
  • (5) The following therapeutic proposal was adapted: On the maxilla, a three-step procedure: first step: building of metal copings on 13, 16 and 26 and metal-ceramic crowns on 11 and 21, second step: building of telescop crowns on 16 and 26 and clasps on 13, 11 and 21, third step: casting of the removable partial denture framework and soldering to the telescop crowns and clasps.
  • (6) Wettability of the liquid solder on UNI METAL was better than on Victory II.
  • (7) The stainless steel shank is a cathodic component of a three-way galvanic cell, whereas the silver soldered joint is an anodic component.
  • (8) If you only have an 20cm tin you can use that instead, but don't use all the batter – about 80% will suffice – otherwise you'll end up with a volcanic overspill, cake soldered to the floor of the oven and a frayed temper.
  • (9) Using the rat as a model, a partial transection of the ventral urethra was repaired in one of three ways in 39 animals: conventional microsuture repair, laser assisted microsuture repair and laser assisted microsuture repair with a protein solder.
  • (10) Three alloys had corrosion resistance superior to the other solders.
  • (11) We form a kind of chain, soldered together by grief and suffering, but also by a way of living and thinking which the killers wanted to destroy.
  • (12) Workers in the following job categories experienced the highest annual mean PbB levels: paste machine operators (battery plants), solder-grinders (assembly plants), and crane operators (foundries).
  • (13) Soldering flux used in the electronics industry can cause both irritant and allergic contact dermatitis.
  • (14) Soldering fractures constitute an important cause of the removal of appliances during the first 8 years following application.
  • (15) In this study about melting and torchs employed in solder in fixed prosthodontics, it's analysed the accurate melting, adequate quantity, as well as protection of adjacent tissues with an accurate anti-melting.
  • (16) Two cobalt-chromium alloys (Blue Elgiloy, Crozat) and an austenitic stainless steel alloy (Remanium) were soldered by an electrochemically generated hydrogen-oxygen flame forming an overlapped joint design.
  • (17) The aim of this study was to determine the release of Au, Cu, Sn, Zn, and Ag from five commercially available Cd-free gold solders.
  • (18) The question of whether to cast in one piece or in multiple sections that are soldered is discussed.
  • (19) In the case of soldering electrically wrought wire clasps to metal structures such as rests and connectors, there is no fear of of overheating a wide area of wires.
  • (20) In the sample studied the proportion of foods contained in non-soldered as opposed to soldered cans has risen consistently during the survey and now accounts for 83% of all samples (excluding sardines).

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